As a Packaging Engineer, you will play a key role in the development of advanced photonic modules for next-generation telecommunications and datacom applications. Working at the intersection of photonics, electronics, and precision assembly, you will be responsible for developing and optimizing packaging processes, supporting module characterization and testing, and collaborating with multidisciplinary teams to deliver high-performance, manufacturable products. This role offers the opportunity to contribute directly to innovative photonic technologies while driving improvements in quality, reliability, and production efficiency.
Founded in 2014 and based in Portugal, PICadvanced develops innovative Integrated Photonics and Advanced Packaging solutions for telecommunications and datacenter applications. Leveraging expertise across electronics, optics, photonics, digital signal processing, and automation, the company delivers cutting-edge optoelectronic products, engineering services, and next-generation technologies based on Photonic Integrated Circuits (PICs). Through strong participation in European innovation projects and a state-of-the-art infrastructure that includes specialized laboratories and cleanroom facilities, PICadvanced transforms advanced research into high-performance solutions for the future of connectivity